YNV12T05 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 5 A
The
Products: Y-Series
Features
? RoHS lead-free solder and lead-solder-exempted
products are available
? Delivers up to 5 A (27.5 W)
? Industry-standard footprint and pinout
? Single-in-Line (SIP) Package:
o 0.90” x 0.40” x 0.213”
Applications
o 22.86 mm x 10.16 mm x 5.41 mm
? Weight: 0.07 oz [2.00 g]
?
?
?
?
?
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
? Synchronous Buck Converter Topology
? Start-up into pre-biased output
? No minimum load required
? Operating ambient temperature: -40 °C to 85 °C
? Remote ON/OFF
? Fixed-frequency operation
? Auto-reset output overcurrent protection
Benefits
? High efficiency – no heat sink required
? Reduces Total Solution Board Area
? Minimizes part numbers in Inventory
? Auto-reset overtemperature protection
? High reliability, MTBF approx. 71.8 million hours
? All materials meet UL94, V-0 flammability rating
? UL60950 recognition in U.S. & Canada, and
DEMKO certification per IEC/EN60950
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate
Bus Architecture (IBA). The YNV12T05 non-isolated DC-DC converters deliver up to 5 A of output current in an
industry-standard through-hole (SIP) package. The YNV12T05 converters operate from a 9.6 VDC–14 VDC input.
These converters are ideal choices for Intermediate Bus Architectures where Point-of-Load power delivery is
generally a requirement. They provide a resistor-programmable regulated output voltage of 0.7525 to 5.5 VDC.
The YNV12T05 converters provide exceptional thermal performance, even in high temperature environments with
minimal airflow. This is accomplished through the use of circuit, packaging and processing techniques to achieve
ultra-high efficiency, excellent thermal management, and a very sleek body profile.
The sleek body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
MCD10201 Rev. 1.0, 24-Jun-10
Page 1 of 26
www.power-one.com
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